Samsung's archrival becomes first chipmaker to launch 300+ layer TLC NAND flash memory; SK Hynix's 321-layer 1-terabit TLC paves the way for more affordable 100T…
The 321-layer NAND was made possible by SK Hynix’s "Three Plugs" process technology, which involves electrically connecting ...
Tesla is eyeing HBM4 chips from Samsung and SK Hynix to power its Dojo supercomputer
Tesla wants to integrate the next-gen high-bandwidth memory into its Dojo system. Dojo is a custom-built supercomputer ...
SK Hynix beats Samsung by launching its 321-layer TLC NAND flash memory first
SK Hynix recently released its new 1-terabit 4D NAND chips, setting a new record. The company is on a streak as it was also ...
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Samsung finishes development on next-gen 400-layer NAND, 1Tb 400-layer TLC NAND in early 2025
Samsung plans to provide details on its new 1Tb 400-layer triple-level cell (TLC) NAND at the International Solid-State Conference (ISSCC) 2025 which will be held in the US in February 2025.
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Chinese PCIe 5.0 SSD with domestic YMTC NAND hits 14.5 GB/s speeds
Zhitai's TiPro9000 SSD with 5th Gen YMTC 3D NAND and Silicon Motion SM2508 SSD controller benchmarked, appears to be one of ...