EDN

‘The number of wafers processed with DRIE will see 5X growth 2011–2017,’ announces Yole Développement

Lyon, France – May 15, 2012 – Yole Développement announces its report “DRIE Technology & Market”. In this report, Yole Développement analyzes the technical & economic evolution of the DRIE technology.
EDN

SPTS Technologies Takes 900th Order for Deep Reactive Ion Etch (DRIE) Module

SPTS Technologies, a leading manufacturer of etch, deposition, and thermal processing equipment for the semiconductor and related industries today announced it has received an order for its 900 th ...
Business Wire

Tegal Receives Order for Tegal 200 SE Silicon DRIE Process Tool from Fraunhofer Institute for Microelectronic Circuits and Systems

PETALUMA, Calif.--(BUSINESS WIRE)--Tegal Corporation, (NASDAQ:TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today ...
Semiconductor Engineering

Effective Post-TSV-DRIE Wet Clean Process For Through Silicon Via Applications

Deep Reactive Ion Etch (DRIE) processes used to form through silicon vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must ...
Business Wire

Research and Markets: Deep Reactive Ion Etching: Equipment & Materials Market Report 2012 - NUmber of Wafers Processed with DRIE Will See 5X growth 2011 - 2017

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/m3vl8b/deep_reactive_ion) has announced the addition of the "Deep Reactive ...
AZoNano

3D Nanopatterning and Nanofabrication: Using Nano-Scalloping Effects in Bosch Deep Reactive Ion Etching

In silicon-based MEMS (micro-electromechanical systems) fabrication, the Bosch DRIE has been commonly used to etch microscale deep trenches with vertical sidewalls due to its high etch selectivity for ...