After previously trying out low-tech compression molding with a toaster oven and 3D printed molds, [future things] is back with a video that seeks to explore some of the questions raised after the ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

A study conducted jointly by ORNL and IACMI attempted to 3D print developmental tooling to compression mold sheet molding compound (SMC) using high-temperature carbon fiber-reinforced thermoplastics ...