You may make one of the tastiest foods available at the grocery store, but if your packaging does not attract consumers it's not helping your marketing efforts. While some businesses only see ...

Even the most iconic products sometimes need a refresh to stay relevant and eye-catching on store shelves. Redesigning packaging to give a well-established product a fresh face is no small feat—it ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Once upon a time, integrated circuits (ICs) were built by the same companies that designed them. The design of an IC was tightly integrated with the manufacturing processes available within each ...

Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

When one thinks of leading-edge semiconductor companies, companies such as Intel, AMD, and Samsung instantly come to mind. But as more semiconductor companies emphasize IP and outsource their ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...