Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit potentials of ...

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

ChEmpower Corp., a semiconductor materials company that develops polishing pads and chemical solutions, today announced Chakra, its first product designed to improve efficiency, reduce costs and ...

A research team has successfully developed a new technology that converts the conductivity properties of semiconductors with just one laser process. Subscribe to our newsletter for the latest sci-tech ...