Once, sawing was considered a secondary machining process and saws were used mostly for cutting bar stock in preparation for other machining operations. In recent years, the development of new types ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...

Rattunde is introducing the new ACS + CFMcurve Integrated Sawing and Machining Center, which uses sophisticated electronics, servo motors and custom-developed software to control the saw blade during ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

Honeycomb core materials, such as aramid, aluminium, and fibreglass, are used in areas such as interiors, winglets, spoilers and many other parts in commercial and military aircraft, helicopters and ...

A trio of companies is attempting to reduce the waste caused by wafer-sawing processes by growing crystalline silicon on relatively cheap foil. NREL has teamed up with DOE's Oak Ridge National ...

You can't do much to lighten the work load for these machines, but you can provide a little tender loving care that will help keep them running smooth the rest of the season. A little lubrication goes ...