Application Note Package Thermal Characteristics Introduction Managing heat in CMOS Logic devices is a growing issue for today's system designers. As densities increase and process geometries and form ...

With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming ...

As some of the newer dc-dc point-of-load (POL) converters are packaged into smaller and smaller surface-mount packages, thermal and electrical layout is becoming critical. One of the packages that ...

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

The primary goal in thermal design is to limit the junction temperature of integrated circuits. In their lists of absolute maximum ratings (Table 1), all IC manufacturers include the maximum operating ...

Managing the heat within smaller packages is a technical challenge that requires innovative solutions, discovers Liam Critchley. The power demands of high-performance electronics generate heat as a ...