News

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QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
This milestone marks the first time eFPGA Hard IP has been delivered for a sub-5nm process node and is expected to set new ...
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NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened ...
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Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
Trusted Semiconductor Design Partner Combines Deep Expertise with a Fresh Vision to Deliver High-Performance Custom Chip Solutions for AI, Automotive, 5G, networking, and other applications ...
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Wi-Fi 7 (802.11be) RF Transceiver IP Core Ready for High Speed Wireless Connectivity Applications
T2M IP, a leading provider of semiconductor IP cores and advanced connectivity solutions, today announced the availability of its partner’s next-generation Dual-Band Wi-Fi 7 RF Transceiver IP Core ...
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Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
In a joint developer track session with Imagination Technologies and Andes Technology, Baya chief software architect Dr. Eric ...
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Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
Building on a series of recent collaborations, Siemens has achieved certification for its Calibre® nmPlatform software ...
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Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today announced it has joined the Intel Foundry Accelerator Design Services Alliance.